After encapsulation, thermo-mechanical deformation builds up within the electronic
packages due to temperature coefficient of expansion mismatch between the respective materials
within the package as it cools to room temperature. Models and design of experiments/response
surface methods are more and more performed for optimizations at early phases of the product
development process. This is especially the case for electronic components in the fields of mobile
application, automotive and power applications which are exposed to mechanical shock or high
thermal environmental conditions. At the same time, a continuous industry drive for
miniaturization and function integration forces the development of feature sizes down to the
nanometer range and the introduction of new nano-particle filled or nano-porous materials. These
developments cause new challenges for reliability analysis, i.e. the development of multiple
failure criteria for combined loadings including residual stresses, interface delamination, cracking
and fatigue of interconnects simultaneously. In finite element analysis (FEA), when localized
behavior of a large model is of particular concern, generally one would refine the mesh until it
captures the local solution adequately. Multi-scale simulation (or global-submodel) is an
alternative way for solving this kind of problem. It provides a relatively accurate solution at a
modest computational cost.